Taipei, Taiwan (May 29, 2023) – Ingrasys, a global leader in cloud IT and infrastructure, announced today its return to Computex from May 30 to June 2. This year, Ingrasys will build a whole green world to invite visitors to immerse in its newest green technologies at booth #I0418. Under the exhibit concept of “Think Green, Build Green”, Ingrasys will showcase how it combines innovations with sustainability to build environmentally responsible solutions towards a more livable future.    As a renowned data center infrastructure provider, Ingrasys recognizes the rising energy consumption of data centers has long been a great concern to the environment. Committed to driving change and promoting sustainability, Ingrasys has been developing eco-conscious solutions to minimize environmental impact without compromising high performance required for today’s evolving needs. One highlight of its exhibition innovations is Modular Building Block. Ingrasys takes a groundbreaking approach to break down the traditional legacy motherboard into modular subassemblies and quickly compose multiple new systems powered by the 4th Gen EPYC™ processors and 4th Generation Intel® Xeon® Scalable processors. Embracing the power of reuse, the modular systems can span across generations only by replacing a subassembly, which greatly reduces material waste and lowers embodied carbon footprint. The recent explosion of artificial intelligence has driven surging demand for high computing power, which comes at the cost of generating substantial heat. At the forefront of the industry, Ingrasys offers an extensive portfolio of Liquid Cooling Solution, including rack-level liquid cooling and immersion cooling, to accommodate different data center cooling requirements. Data centers can enjoy unprecedented levels of energy efficiency, which reduces both operational costs and energy consumption. Moreover, the company sets itself apart by offering one-stop service for businesses that seek a total cooling solution from initial design, verification to production. One of the key advantages of Ingrasys solution is its modular nature. All components within the cooling rack are modular design, which can swiftly build rack or immersion systems to meet customer’s needs. Other booth highlights include an AI Journey where Ingrasys high-performance storage and liquid cooled AI server, equipped with eight of the newest NVIDIA H100 Tensor Core GPUs, unleash the power of AI, and an ESG focus area that exhibits company eco-friendly initiatives towards a net zero world. Through its participation at Computex, the company aims to demonstrate how it enables businesses to move towards their sustainability goals and inspire industry partners and stakeholders to build green together for a world where sustainability thrives on innovative technology. ( Ingrasys showcases eco-friendly products and solutions with the theme "Think Green, Build Green" at the COMPUTEX Taipei. )   (Ingrasys offers comprehensive system services from design to production, accelerating sustainable goals.)  

15th May 2023, automotive system software provider AutoCore.ai announces the completion of A+ round fundraising led by Bosch Ventures and BoYuan Capital, joined by existing shareholder GL Ventures. We are witnessing an era represented by automotive chips powered with complex and advanced computing capabilities, as well as the multifold growth of intelligent sensors. The massive amount of data has brought about exponential growth and challenges in data transmission, scheduling and management. Automotive middleware will become the fundamental must-have software for intelligent vehicle development, with its market potential reaching tens of billions of dollars in the medium and long term. Along with the explosive growth of the market, AutoCore.ai, established in 2018, has rapidly developed into a global automotive software platform-oriented enterprise, based on the self-developed AutoCore.OS platform, providing middleware, system software products, algorithm and application software licensing services with SOA oriented architecture across entire vehicle. AutoCore.ai has created a complete and unified in-vehicle data platform for OEMs to achieve system-level functional performance, safety and security with guarantees for real-time, deterministic and secure communication, transmission, scheduling and planning of data across all vehicle domains, supporting different EE architecture. As a global leader in providing advanced automotive infrastructure software products and services, AutoCore.ai has witnessed its significant growth each year in terms of team, product maturity, engineering capabilities, tools, and customer base. AutoCore.ai is the first middleware supplier in the world to have its full-stack software products certified to ISO 26262 ASIL-D, the highest functional safety level, currently adopted by many leading OEMs and Tier1s in their mass production programs around the world. AutoCore.ai is also a chosen strategic partner by several mainstream chip manufacturers.   It is reported that the lead investors of this round, Bosch Ventures and BoYuan Capital, are both investment funds of the Bosch Group,  a global leader of automotive electrical and electronic architecture. Bosch Group is the main initiator and supporter of Autosar standard, the world's largest automotive Tier1 system integrator, and has irreplaceable influence across the automotive industry supply chain. AutoCore.ai will work with Bosch Group to explore new technologies and products, work together to respond to the rapidly changing needs of the global automotive industry on a larger scale and at a faster pace. This strategic investment marks the next step growth of its core alliance AutoCore.ai has been able to build globally. The alliance with Bosch represents the new generation EEA solution moves into a mature and mass production stage, enabling global OEMs. Bosch ETAS group believes that AutoCore.ai will also strategically benefit from Bosch’s strong network and communities for the Software-defined vehicle by leveraging collaboration opportunities with its entities and partners. “We believe that AutoCore.ai will represent China's outstanding innovative enterprises and become a sought-after specialist in the international automotive supply chain”, says Dr. Ingo Ramesohl, Managing Director of Bosch Ventures. GL Ventures partner Qiang Li says, “GL Ventures has been supporting AutoCore.ai since Pre-A, this is our third consecutive investment into AutoCore”. AutoCore.ai team has demonstrated outstanding capabilities in product development, market penetration as well as accumulation of abundant industry know-how in very short period of time. It has already produced many robust products, first of their kinds in the industry. Safe, high performance and high reliable middleware is one of the key areas of volume intelligent mobility. We are delighted to witness the exciting adoption from OEMs, Tier1s and other partners of AutoCore.ai’s product and technology. We trust that under Dr. Yang Zhang’s leadership, AutoCore.ai will continue to deliver critical value to its customer base, playing an important role in this wave of intelligent automotive evolution. Dr. Yang Zhang, Founder and Chairman of AutoCore.ai, says “we are thrilled that our hard work and unwavering dedication being recognised by our wide customer base, glad that Bosch choose to be part of the journey. We expect close collaboration between us in global arena. We would also like to take this opportunity to thank all of AutoCore.ai’s shareholders. We wouldn’t be here without their commitment and support.”

(Taipei, January 2, 2023) – FIT Hon Teng Limited (“FIT” or “Company”, SEHK stock code: 6088) today announced it entered into SPA to acquire PRETTL SWH group, horizontally expanding its core capabilities in EV components and extending its mobility solutions. Following the acquisition, PRETTL SWH group will be wholly owned by FIT. PRETTL SWH group's competitive strategy is similar to that of FIT. PRETTL SWH group's product portfolio focuses on niche segments as it offers high-margin and high-precision manufacturing products in the industry. Furthermore, due to its solid automotive component design capabilities, PRETTL SWH group works closely with automotive customers and have established long-term client relationships in the industry. With decades of experience and a leading position in the automotive industry, PRETTL SWH group assists its customers in developing and manufacturing best-in-class, high-end automotive sensor harnesses and connectivity and electrification solutions. Its customer base spans traditional automotive OEMs, new mobility OEMs, and global large-scale Tier 1 and Tier 2 automotive system suppliers. PRETTL SWH group has grown significantly over the past few years, supported by a strong balance sheet. Upon the completion of the acquisition, PRETTL SWH group is expected to contribute meaningfully to FIT’s annual revenue and net income over the short and medium term.   PRETTL SWH group's three core business segments - Sense, Connect and Electrify perfectly match FIT's current EV strategic development directions focusing on Power Connection, Data Connection and Human to Machine connectivity. The transaction will create synergy by combining PRETTL SWH group's high-quality module and component products with FIT's current system. Taken together, FIT and PRETTL SWH group will work hand in hand to offer comprehensive EV solutions. Also, PRETTL SWH group's global network of manufacturing, sales and R&D will enable FIT to expand its key EV component strength horizontally. FIT is on track to build out the higher-margin product portfolio by continuously executing its 3+3 strategy (EVs, Audio, and 5GAIoT). This acquisition aligns with FIT's 3+3 strategy and will create new growth drivers in EV mobility.   About FIT Hon Teng Foxconn Interconnect Technology (FIT) is a leading global solutions developer and manufacturer cultivating connectivity for a better world. With unsurpassed capabilities in development, research, manufacturing engineering and design, production, supply chain, and go-to-market planning for world class brands and private label products spanning B2C and B2B categories, FIT is at the forefront of worldwide technological trends delivering compelling user experiences at scale. With offices and manufacturing sites located in Asia, the Americas and Europe, FIT is a global leader in the manufacturing of high precision interconnect components. For more information, visit FIT’s website: fit-foxconn.com.   About PRETTL SWH group With many years of experience in the industry, PRETTL SWH group is one of the leading developer and manufacturer of best-in-class sensor, connectivity and electrification solutions for the Automotive and New Mobility OEMs* (commercial electrified vehicles like trucks, buses, tractors and vans, pedelecs, electrified 2Wheelers and Light Electric Vehicle) as well as Tier 1 and Tier 2 Automotive system suppliers. PRETTL SWH group is based in Pfullingen, Germany, with a global footprint of 18 locations across 13 countries, with ca. 8000 skilled employees worldwide. As a contributor of the world’s most dynamic industries, it is essential to create with forward-looking, innovative approach in the areas of expertise while respecting the values of the past. For more information, visit: www.prettl-swh.com.

Lead investor Foxconn funds Sonatus technology to support their EV platform; Sonatus ramps into volume production Sunnyvale, Calif. – December 7, 2022 – Sonatus, a leading automotive software company that is accelerating vehicle innovation towards software-defined vehicles, today announced it has raised $75 million in a second round of funding. Global technology company Hon Hai Technology Group (“Foxconn”) (TWSE: 2317), the world’s largest electronics manufacturer, led the fundraising round. Combined with the earlier Series A round, Sonatus has now raised over $110M USD from venture capital, strategic partners and customers. Sonatus is focused on delivering foundational technologies and solution stacks that empower customers and partners to transition to software-defined vehicles (SDV) faster and support them to deliver their own differentiated solutions. By employing these key building blocks from Sonatus, automotive companies and their ecosystems can deploy innovations to market faster, at lower cost, with more reliability, and frequency than current approaches, which is critical in a competitive market. “Foxconn’s vision is expanding into the EV market where we intend to produce brand agnostic automotive solutions as we have successfully done in other industries from PCs to mobile phones,” said Eric Yeh, Senior Director, Software Development Center, Foxconn. “Sonatus has an impressive track record of delivering in-vehicle and cloud software solutions into volume production, and is a strategic partner with the right synergy to provide seamless integration between automotive software and hardware.” Sonatus’ software platform is in production in Hyundai, Kia, and Genesis vehicles, including multiple Genesis car and SUV models. It is also used in the Hyundai Ioniq 6, and others, and will be in millions of cars by 2023.  Sonatus has grown its team significantly and has expanded its presence in France, Italy, Japan and China to focus on further growth and deployment of Sonatus products and solutions into additional applications, regions, partner projects and end customers. “We are thrilled with the progress Sonatus has achieved in the past year and a half, meeting and exceeding our plans and growth targets and delivering on the milestones we committed to our partners and customers,” said Jeffrey Chou, co-founder and CEO, Sonatus. “With this new fundraising round, we have the resources to significantly expand our growth and mission to deploy software-defined vehicle technologies into new markets and additional customers. The potential benefits of dynamic software in cars is only just beginning and Sonatus is ideally positioned to accelerate vehicle software innovation into the future.” At CES 2023, Sonatus will have a significant presence in the West Hall of the Las Vegas Convention Center to demonstrate a wide range of technologies and solutions including those in production with vehicles from Hyundai Motor Group brands Hyundai, Kia and Genesis. Additionally, it will demonstrate next-generation software solutions, built on advanced automotive gateway reference designs from semiconductor and Tier 1 suppliers, that will enable car manufacturers to digitally transform vehicle architectures. Sonatus works with major silicon manufacturers including NXP and Marvell, as well silicon collaboration initiatives including the Renesas R-car consortium and the SOAFEE initiative. Sonatus has been recognized by significant industry awards including 2022 PACE Awards and finalist nominations, 2022 CES Innovation Award, 2022 AutoTech Breakthrough Overall Connected Car Solution, and the 2022 Informa Tech Automotive Group Software Supplier of the Year.   ABOUT SONATUS Sonatus is accelerating vehicle software innovation and the transition towards software-defined vehicles. Our platforms and products serve as the key building blocks that allow automotive companies and their ecosystem to innovate faster and deliver continuous improvements in costs, capabilities, reliability, and user experience over the vehicle lifespan. Sonatus’ award-winning software platform is in production vehicles from Hyundai, Kia and Genesis, and will be on the road in millions more vehicles in 2023. The company has raised more than $110 million USD with world-class automotive, technology, and venture investors including Foxconn, Hyundai Motor Group’s Kia Corporation, LG Electronics, Marvell, SAIC Capital, Translink Capital, UMC Capital and Wanxiang Group Company. Sonatus is headquartered in Sunnyvale, CA, with offices in Paris, France and Seoul, Korea. For more information visit www.sonatus.com.

• Agreement is worth 359 million Saudi Riyals; • Site location covers over 1 million square meters and will be the location for Ceer’s manufacturing facility; • Ceer’s manufacturing facility will create thousands of direct and indirect high-skilled jobs, the majority for Saudi nationals, and will contribute to Saudi Vision 2030 through the transfer of knowledge and manufacturing localization. Riyadh, Saudi Arabia, November 29 2022 – Ceer, Saudi Arabia’s first electric vehicle brand, has signed a land purchase agreement worth 359 million Saudi Riyals with Emaar, the Economic City, for land at King Abdullah Economic City (“KAEC”) that will be used to develop Ceer’s manufacturing facility for electric vehicles. The site, located in Industrial Valley (IV) in close proximity to King Abdullah Port in KAEC, will cover over 1 million square meters. Once complete, Ceer’s manufacturing facility will create thousands of direct and indirect high-skilled jobs, the majority of which will be filled by Saudi nationals. Construction at the site will begin early 2023. The company, which is a joint venture between the Public Investment Fund (“PIF”) and Hon Hai Precision Industry Co. (“Foxconn”), will manufacture a portfolio of technologically advanced sedans and sports utility vehicles at the factory in KAEC. Ceer vehicles are scheduled to be available from 2025 onwards. The factory will be state-of-the-art, featuring the latest technologies to ensure manufacturing efficiency whilst minimizing energy and water usage. Ceer will work towards making the factory a zero waste to landfill site.  Ceer’s Chief Executive Officer, James DeLuca, said: “We have found a place that meets all our needs. KAEC offers us a great location with world-class logistics, effective access for our global and Saudi-based suppliers, and an ideal location to base and develop our future workforce. KAEC will become our manufacturing hub as we work towards creating the first electric vehicle brand for Saudi Arabia and the wider region and, in doing so, contribute in a meaningful way to Saudi Vision 2030.” The establishment of Ceer comes in line with the PIF strategy to focus on unlocking the capabilities of promising sectors in Saudi Arabia, including the automotive sector, as well as creating opportunities for the growth and diversification of Saudi Arabia’s economy. “We are delighted to welcome Ceer to KAEC and to help make history by building the first automotive manufacturing hub in Saudi Arabia and the wider region,” said Cyril Piaia, CEO of Emaar, The Economic City, the master developer of KAEC. “KAEC is aiming at integrating into Vision 2030 initiatives with the vision to be a global manufacturing center, and we are spearheading the creation of an electric vehicle automotive industry that will be both innovation-focused and have sustainability at its heart. We cannot wait to see the cars of thefirst Saudi electric vehicle brand coming out of Ceer’s factory at KAEC in a couple of years’ time, and we are proud to be able to contribute to a project that supports so many facets of Saudi Vision 2030. This agreement is in line with KAEC’s new strategy to welcome third-party anchor investors, developers,and operators to realize their projects and ambitions in the city and accelerate its development.”

Automotive executive joins Ceer after a distinguished career at General Motors; In his last role, DeLuca led VinFast, Vietnam’s first domestic automobile brand; Riyadh, 17 November 2022 – Ceer’s Board of Directors has appointed James DeLuca as the company’s CEO. DeLuca has over four decades of experience in the automotive sector, including senior leadership roles at both General Motors and VinFast. DeLuca will oversee the development, manufacturing, and sales of Ceer’s portfolio of consumer vehicles with the aim of producing iconically-styled electric cars replete with advanced technologies and features. DeLuca led Vietnam-based car manufacturer VinFast as its first CEO, creating South East Asia’s first electric vehicle brand. Prior to VinFast, DeLuca led General Motors’ manufacturing function across the globe, overseeing the company’s production processes while managing over 200,000 employees at 171 plants in 31 countries. “Saudi Arabia recognizes the importance of the automotive sector when it comes to economic growth and job creation, and I am looking forward to shaping Ceer into a car brand that is admired by both Saudi consumers as well as the wider industry,” said DeLuca. “Ceer will help ignite Saudi Arabia’s automotive sector and create synergies of scale that the automotive industry will benefit from as more automotive manufacturing moves to the Middle East to make electric vehicles mainstream in the country and the wider region.” Ceer is a joint venture between the Public Investment Fund (PIF) and Foxconn. Ceer will manufacture vehicles in Saudi Arabia. Each vehicle will be designed and manufactured in Saudi Arabia and tested to the highest global automotive quality control and safety standards. Ceer vehicles are scheduled to be available in 2025. Saudi Arabia has laid out a number of targets for its own automotive sector, with a focus on creating a sustainable industrial base that will contribute to the country’s GDP growth, promote the transfer of knowledge to the Kingdom and spur job creation. Today, Ceer has more than 400 employees that have already started designing and engineering Ceer’s vehicles.

MIH unveils Project X: an A-Segment Electric Vehicle Platform with Modular Design Approach   Enabling mobility service providers, fleet operators, and mobility brands to customize vehicles based on their needs  TAIPEI－The Foxconn-initiated MIH Consortium announced Project X, an open and agnostic EV Platform for the innovators, by the innovators. MIH is lowering the entry barrier for companies entering the electric vehicle market to customize vehicles based on their needs. To make it easier for partners and potential customers to understand the open and agnostic nature of MIH and to realize technologies developed by the MIH Working Groups, MIH released the Project X timeline and exterior design for the first time and this A-segment three-seater demo car is expected to be presented by the end of 2023. MIH is enabling innovators to create the future of mobility for the next generation by building an open EV ecosystem with the BYOV (Build Your Own Vehicle) model. With modular design approach and standardized interfaces, innovative products can be introduced in less time and cost, fulfilling the needs of different audiences and enabling new business models for car sharing companies, mobility service providers, fleet operators, logistics service providers, and new EV brands. “MIH is writing the next chapter of the future of mobility. Project X is a demonstration of a new EV platform for the ecosystem. We’re not only making cars but also enabling the creation of more lifestyles,” said Jack Cheng, CEO of MIH Consortium. “Thinking beyond the vehicles of today and by adopting the latest technologies such as artificial intelligence, autonomous driving, and Web3, this vehicle platform can create shared mobility, digital health care in a post-pandemic society, entertainment, and other future applications unimaginable today. Project X’s goal is to develop the world’s most iconic open EV platform for the innovators, by the innovators.” MIH is inviting its MIH members to participate and co-create this platform in the early stage of vehicle development and is implementing technologies the MIH Working Groups develop, including powertrain, battery systems combined with fixed charging and battery swapping technology, zonal electrical and electronic architecture (EEA) and decentralized identifier (DID) for enhanced privacy. The A-segment vehicle platform is just the beginning, MIH will release six-seater and nine-seater vehicle platforms in the coming years to provide more vehicle segment choices to enable more innovation. MIH Consortium has more than 2,500 members and held its annual event MIH Demo Day on November 8th with over 2,000 attendees joining in-person and online, and 100 partners attended the event, including Hon Hai Technology Group, emerging luxury EV brand Karma Automotive, TomTom, National Instruments (NI), NXP, Trend Micro automotive security company VicOne, Salesforce, and more.

24 August 2022, Taipei, Taiwan – FARobot, the strategic joint venture by Hon Hai Technology Group (“Foxconn”) (TWSE: 2317) and ADLINK Technology Inc (TWSE: 6166) today debuted its “Swarm Autonomy” solution at the Automation Taipei exhibition which is the world's first robotic management platform with cross-brand integrability across IT, OT systems, IoT devices, and factory equipment. “Swarm Autonomy” solution is expected to be introduced into Hon Hai’s Lighthouse Factory Network in the future to optimize the Group's intelligent manufacturing system. Demand volatility is shaping the new productivity standard, with additional challenges of labor shortage and rising costs, driving manufacturers and logistic operators to seek more flexible and resilient solutions. In two short years, with the strength of Hon Hai’s vast manufacturing data and ADLINK’s cutting-edge communications technology for industrial applications, FARobot has designed a fitted solution for international manufacturers to solve those issues, paving the way to enter the global smart manufacturing and logistics market. “Robotics is one of FOXCONN Group's "3+3" emerging industries and is our solid foundation for moving toward automated, digitized, and intelligent production,” said James Tu, Chief Investment Officer of FOXCONN and Chairman of FARobot. “FARobot is expected to play an important role in the Group's smart manufacturing system in the future.” “The Swarm Autonomy solution enables flexible interoperability across limitless robotic fleets running on a universal platform (Swarm Core) with a universal robotic communication technology (Swarm Protocol), enhancing production efficiency and equipment utilization.”, said Ryan Chen, General Manager of FARobot. The Swarm Core software platform features agile integration, enabling easy deployment and scalability of cross-brand robots and equipment into the existing system and network infrastructures; agile operation, which delivers dynamic configuration, intelligent management, real-time monitoring, and control of robotic fleets and field equipment thanks to robotic knowledge sharing technology; and agile optimization, which dynamically schedules operation tasks to ensure an uninterrupted process flow even in case of unexpected situations. During the exhibition, FARobot also launched its highly reliable Swarm Mobile Robot (SMR) series designed in compliance with the EN ISO 3691-4 standard. The SMR250 and SMR1000 of 250kg and 1000kg payload respectively support seamless integration with Swarm Core, enabling agile collaboration with factory equipment. It is widely compatible with various sensors and top-modules and ideal for diverse environments and OEM sectors.  FARobot will demonstrate the Swarm Autonomy solution live during Automation Taipei 2022 being held Aug 24-27. Please visit us at TaiNEX2, 1F, P832. [About FARobot] FARobot is a joint venture founded by FOXCONN (TWSE: 2317) and ADLINK (TWSE: 6166), focusing on DDS-empowered robotic technology. Its patented Swarm Core platform enables agile collaboration among different types of operating equipment, as well as IT, OT, and IoT devices from various partners. Along with its Swarm Mobile Robot (SMR) series, the Swarm Autonomy solution introduces game-changing intralogistics automation and enhances optimized efficiency in manufacturing, logistics, retail, and healthcare sectors.

（From Microwave Journal） 1.    iCana is the result of Foxconn's acquisition of fabless RFIC supplier arQana. Tell us the history of arQana and what motivated Foxconn to buy the business. arQana was founded in Singapore five years ago with its focus on offering RF components for radar and satellite communications. In time, the company moved into the 5G wireless infrastructure communications market. arQana’s acquisition by Foxconn fits into Foxconn’s 3+3 strategy, in which semiconductors, wireless telecommunications and automotive connectivity are all key pillars. 2.    What is the relationship between Foxconn and iCana? iCana is fully owned by Foxconn, yet operates as an independent subsidiary of Foxconn directly under the chairman’s office. 3.    What markets will iCana serve and with what products? Do you intend to build a catalog of products or focus on custom designs for large customers? We already have a large product catalog for 5G wireless infrastructure that we intend to extend to cover all active components in the RF front-end, both for FR1 and FR2. Being part of Foxconn provides opportunities to move into new markets that align with Foxconn’s long-term strategy of EV developments, consumer products and smart manufacturing. Our product roadmap is mainly driven by product portfolio; however, we do some custom designs for very large customers. 4.    What semiconductor processes and packaging technologies are your designers using? We are using III-V GaAs and GaN semiconductor processes—also CMOS, especially when more integration is needed. Our component packaging is not trivial, and it typically comprises a mix of actives and passive components connected internally inside the package, with thermal design an increasingly important aspect. 5.    How are iCana's products differentiated in this competitive market of RFIC suppliers? Our products are highly competitive, achieving the same or even better performance results as other tier-1 industry RF component suppliers. We offer pin-to-pin compatibility with other suppliers, promoting component supplier diversification at the customer side, needed in the industry. Key to our customers is the high level of application engineering support. 6.    Give a couple of examples from your catalog or products under development that highlight your capabilities. A good example using III-V technology is ARQSP3338-8, which is a Doherty amplifier for 5G FR1 small cells, with very broadband operation for band n78, high efficiency and excellent linearity with DPD. For 5G FR2 or the mmWave market, we are developing our own beamformer, ICAMB2427-A, which showcases our capabilities of achieving a high performance integrated IC using a silicon process. 7.    Which markets or products hold the best growth opportunities for iCana? Definitely our 3 to 6 GHz Doherty power amplifier modules or PAMs for 5G FR1 and our UDC+BFIC (AiM) solution for 5G FR2 are, at this moment, the most promising products that we are bringing to market and for which we receive major interest from the industry. Besides our current offering in 5G RF, our product roadmap for wireless connectivity in the EV space, such as C-V2X, shows tremendous growth potential. 8.    How has the pandemic changed your strategy for growing a new business? Marketing begins by knowing your customer; so not being able to have face-to-face interactions with customers and participating in industry trade shows has been difficult. We had to adapt and change by having more online meetings. From the supply chain perspective, the pandemic also created important disruptions, especially within manufacturing, delaying some of our products. So we had to manage and shift some priorities. As a relatively small company, it is easier to manage these disruptions, which has given us an additional advantage in going to market with our products. 9.    Tell us about your team and where everyone is based. Our headquarters are located in Taiwan, which is where we do all the back end, industrialization, III-V design and address our customers in the APAC region. Our branches in Belgium and USA are mainly dedicated to R&D development activities for silicon-based products, and we are also supporting business development activities with our international customers from there. 10.    What's your own background and the path that led you to iCana? I have an engineering background in RFIC design, which early on in my career I applied to biomedical devices. This led me to set up a technology incubator business in Singapore in the early 2000s, which resulted in the establishment of an RF CMOS design house—Future Waves in Taiwan—providing solutions for digital broadcasting. Future Waves was acquired in 2009, and I took a break from industry for a few years to manage a social enterprise in Vietnam looking after disadvantaged youth. After returning to Singapore, I took on a professorship with the National University Singapore in the Institute for Engineering Leadership to teach practical entrepreneurship to postgraduate engineering, science and medical students. At the same time, I finished my MBA with the University of Chicago. In 2017, I left the university and founded arQana.

MIH Consortium, the Foxconn-initiated open EV alliance that promotes collaboration in the mobility industry, announced Edward Hightower, CEO of Lordstown Motor Corp. (LMC), and Tricia Martinez, Managing Director for Techstars, joining as Advisors to the Board of MIH Consortium. Each with extensive experience in the global automotive and cleantech industry will bring their expertise and abundant resources as MIH enters a new phase to expand footprint globally. MIH currently has more than 2,423 members from 65 countries and regions. The mission is to realize key technologies, develop reference designs and standards, while MIH bridges the gap for alliance members resulting in a lower barrier to entry, accelerated innovation, and shorter development cycles. MIH aims to drive EV adoption through industry stakeholder collaborations and create innovative solutions in line with the spirit of openness and agnosticism, for the next generation of EV, autonomous driving, and mobility service applications. “We believe that Edward Hightower and Tricia Martinez can bring deep knowledge and insights to MIH that will help us expand in depth and breadth of our partnership strategy in the US and open up new opportunities to collaborate with more global partners as we build towards the open EV platform vision,” said Jack Cheng, CEO of MIH Consortium. Mr. Hightower has 30 years of experience serving in product development, engineering, manufacturing, commercial, and senior executive roles between Ford, BMW, and GM. He led GM’s $15 billion global crossovers business as the Executive Chief Engineer and Vehicle Line Executive. At BMW, he helped drive 5 Series sales, market share, and profitability in the U.S. to record levels. Edward Hightower will bring technical expertise, go-to-market opportunities, and connections of the North America automotive industry to MIH. Ms. Martinez is a serial entrepreneur and investor passionate about driving large-scale impact through technology and innovation. Currently, she is the Managing Director for Techstars Industries of the Future accelerator investing in and supporting breakthrough technologies that have the potential to change the world like artificial intelligence, cleantech, quantum, biotech, advanced manufacturing, and 5G technology. Tricia will accelerate the growth of MIH partnerships with corporations, governments, and startups in the US. Jack Cheng (left), CEO of MIH Consortium, Tricia Martinez (upper right), Managing Director for Techstars, and Edward Hightower (lower right), CEO of Lordstown Motor Corp.